降低金属-陶瓷场致扩散连接中残余应力的措施  

The Measures of Lowing Residual Stress from Metal-Ceramic Field Diffusion Bonding

作　　者：刘子建[1] 王久海[1] 刘翠荣[1] 孟庆森[2] 

机构地区：[1]太原科技大学,山西太原030024 [2]太原理工大学,山西太原030024

出　　处：《稀有金属与硬质合金》2007年第3期58-60,共3页Rare Metals and Cemented Carbides

摘　　要：简要介绍了场致扩散连接的机理、特点及应用,指出了残余应力的存在对键合质量的影响。在分析金属-陶瓷场致扩散连接中残余应力产生原因的基础上,给出了降低这些因素影响的具体措施。This paper describes the mechanism, characteristics and applications of field diffusion connection. It is pointed out that the presence of residual stress can affect the bonding quality. Based on the analysis on how the residual stress is generated from metal-ceramic filed diffusion bonding,detailed measures are given to lower the influence.

关 键 词：金属-陶瓷 场致扩散连接 残余应力 键合质量 工艺措施 

分 类 号：TG456.9[金属学及工艺—焊接]