LTCC电路基板大面积接地钎焊工艺设计  

Technology Design for Large Area Grounding Soldering of LTCC Circuit Substrate

作　　者：解启林[1] 朱启政[1] 林伟成[1] 雷党刚[1] 

机构地区：[1]中国电子科技集团第三十八研究所,安徽合肥230031

出　　处：《应用基础与工程科学学报》2007年第3期358-362,共5页Journal of Basic Science and Engineering

摘　　要：提出了一种提高LTCC电路基板大面积接地钎焊的钎着率及可靠性的钎焊工艺设计.在LTCC电路基板接地面设置(Ni+M)复合金属膜层,根据试验测试比较,其耐焊性(>600s)明显优于常规金属化接地层(常规要求>50s);在LTCC电路基板的接地面的一端预置"凸点",通过X射线扫描图对比分析,增加"凸点"的设计提高了大面积接地钎焊的钎着率.研究表明:新的钎焊工艺设计保证了LTCC电路基板大面积接地的钎焊可靠性和一致性.A technology design is put forward to improve the soldering coverage and the reliability of large area grounding soldering of LTCC （low temperature co-fired ceramic） circuit substrate. According to the comparison of experiment test, when a Ni ＋ M multi-layer metal film is setup at the grounding surface of LTCC circuit substrate, its soldering resistance property （〉600s） improving more than normal metal grounding （the general standard 〉 50s ）. Some “solder bumping” setup on the LTCC circuit substrate grounding soldering area can be proved to improve soldering coverage for large area grounding soldering by X-ray scan. The research shows that the new soldering technology design guarantees the reliability and consistency of large area grounding soldering of LTCC circuit substrate.

关 键 词：(Ni+M)复合金属膜层 耐焊性 凸点 钎着率 

分 类 号：TK226.2[动力工程及工程热物理—动力机械及工程]