元器件纯锡镀层表面晶须风险评估与对策  

Evaluation Technique and Countermeasure for Tin Whisker Risk of Tin Plating Components

作　　者：许慧[1] 罗道军[1] 

机构地区：[1]中国赛宝实验室可靠性研究分析中心,广东广州510610

出　　处：《电子工艺技术》2007年第5期249-252,共4页Electronics Process Technology

摘　　要：讨论了各种锡晶须的形态以及其长度的具体测量方法,并在试验研究的基础上进一步分析抑制非光滑(哑光)纯锡镀层上锡晶须生长的对策。研究结果表明,增加锡镀层厚度(>7μm),或通过使用添加剂来产生更加粗糙的表面以适当增大晶粒尺寸,电镀完成后及时进行退火程序是进一步减轻雾锡镀层上锡晶须困扰的有效手段。如果引入N i作为中间镀层,则需要达到一定的厚度(估计>0.7μm),方可达到预期的效果。Various shapes of tin whisker will be presented and the detailed measurements for the length have been studied. The countermeasures to control the growth of tin whisker on matte tin based on the experiments are discussed as well. The results show that thicker tin finish（7μm minimum）,plating matte tin, and timely heat treatment all have an effect on the stress state of the tin and encompass the variety of commercially available mitigation methods. Furthermore, a Ni underlayer may not less than 0.7 μm.

关 键 词：锡晶须 形态 加速试验评估 非光滑锡镀层 

分 类 号：TN60[电子电信—电路与系统]