IMC生长对无铅焊球可靠性的影响  

Influence of IMC Growth on Reliability of Lead-Free Solder Balls

作　　者：沈萌[1] 华彤[1] 邵丙铣[1] 王珺[1] 

机构地区：[1]复旦大学材料科学系,上海200433

出　　处：《半导体技术》2007年第11期929-932,共4页Semiconductor Technology

摘　　要：通过模拟及实验研究了IMC层及其生长对无铅焊点可靠性的影响。采用回流焊将无铅焊球（Sn3.5Ag0.7Cu）焊接到PCB板的铜焊盘上,通过-55-125℃的热循环实验,获得了IMC厚度经不同热循环次数后的生长规律。采用有限元法模拟了热循环过程中IMC厚度生长对无铅BGA焊点中应力变化的影响,并由能量疲劳模型预测了无铅焊点寿命。计算结果显示,考虑IMC层生长所预测的焊点热疲劳寿命比不考虑IMC层生长时缩短约30%。The influence of IMC growth on the reliability of lead-free solder joints was studied by simulations and experiments. The lead-free solder balls （Sn3.sAg0.7 Cu） were connected to the Cu plates on PCB by solder reflow. The samples underwent thermal cycling at - 55 ℃ to 125 ℃. The IMC thicknesses in solder joints subjected to different thermal cycles were measured. Finite element analysis was carried out to study the mechanical performance of lead-free solder balls by accounting the influence of IMC layer＇ s growth. Furthermore, the solder joint lifetime was predicted based on the energy fatigue model and the simulations. The results show that the predicted lifetime with IMC growth is 30% shorter than that without IMC growth.

关 键 词：SnAgCu无铅焊料 电子封装 金属间化合物生长 有限元模拟 

分 类 号：TN305.94[电子电信—物理电子学] TN306