300mm硅单晶生长过程中热弹性应力的数值分析  被引量:2

Numerical Analysis of Thermal Elastic Stress During 300 mm Silicon Crystal Growth Process

在线阅读下载全文

作  者:高宇[1] 周旗钢[1] 戴小林[1] 肖清华[1] 

机构地区:[1]北京有色金属研究总院有研半导体材料股份有限公司,北京100088

出  处:《稀有金属》2007年第5期585-589,共5页Chinese Journal of Rare Metals

基  金:科技部国际合作重点项目(2005DFA51050)

摘  要:采用有限体积元法软件CrysVUn对直拉法生长300mm硅单晶热场和热应力分布进行了模拟,模拟考虑了热传导、辐射、气体和熔体对流、热弹性应力等物理现象。针对晶体生长过程中小形变量的塑性形变,以Cauchy第一和第二运动定律作为局部控制方程,考虑了硅单晶的各向异性,计算了<100>硅单晶生长过程中晶体内von Mises应力分布和变化规律,结果表明在等径生长阶段热应力上升最显著,界面上方晶体内热应力随晶体生长速率增大而升高。A finite volume software CrysVUn was used for the simulation of heat field and stress distribution of 300 mm Si crystal, phenomena as conduct, radiation, convection and thermal elastic stress were considered. Aiming at small plastic shape change during crystal growth process, the internal stress and variety rule of 〈 100 〉 Si crystal von distribution Mises stresswere analyzed. During the crystal growth process, me governing partial equations were Cauchy's first and second law of motion, and anisotropy of Si single crystal was considered. The results demonstrated that von Mises stress increased remarkably during the body growth process and the thermal stress above the interface increased with the crystal growth rate increasing.

关 键 词:热应力 模拟 300 MM 硅单晶 

分 类 号:TN304.1[电子电信—物理电子学]

 

参考文献:

正在载入数据...

 

二级参考文献:

正在载入数据...

 

耦合文献:

正在载入数据...

 

引证文献:

正在载入数据...

 

二级引证文献:

正在载入数据...

 

同被引文献:

正在载入数据...

 

相关期刊文献:

正在载入数据...

相关的主题
相关的作者对象
相关的机构对象