RCC与FR-4制作HDI的工艺兼容性及无铅化应用  

Processing Compatibility and Lead Free Application of HDI Fabricated from RCC and FR-4

作　　者：佘乃东[1] 温东华[1] 

机构地区：[1]广东生益科技股份有限公司,东莞广东523039

出　　处：《印制电路信息》2007年第11期15-19,共5页Printed Circuit Information

摘　　要：文章采用不同型号的RC(C涂树脂铜箔)和不同型号的FR-4基板制作了不同材料组成的四层HDI板,考察了制作工艺的兼容性,对HDI样板进行了无铅化应用测试及相关耐热性测试,结果表明采用不同材料组成制作的四层HDI板表现良好的工艺兼容性,同时成品HDI样板具有优异的无铅焊测试可靠性,能够满足无铅焊应用要求。In this article four layered HDI printed circuit boards were fabricated by different RCC materials and different FR-4 laminates. The fabrication processing compatibility was investigated and lead free application test have been performed with HDI sample board, as well as relevant thermal resistance test. It turned out that fabrication processing of the 4 layered HDI boards with different dielectric material combinations were well compatible, while the finished HDI sample boards showed good Pb free soldering reliability, meeting the requirement of Pb free soldering applications.

关 键 词：RCC HDI 工艺兼容性 无铅焊测试 可靠性 

分 类 号：TN41[电子电信—微电子学与固体电子学]