Sip/Al复合材料导电性能研究及理论计算  

Electrical conductivity properties and numerical analysis of Sip/Al composites

作　　者：武高辉[1] 修子扬[1] 张强[1] 宋美慧[1] 

机构地区：[1]哈尔滨工业大学材料科学与工程学院,黑龙江哈尔滨150001

出　　处：《功能材料》2007年第A02期437-440,共4页Journal of Functional Materials

基　　金：国家高技术研究发展计划（863计划）资助项目（2003AA305110）;2005年哈尔滨市科技攻关计划资助项目（2005AA5CG041）.

摘　　要：摘要：采用挤压铸造专利技术制备了电子封装用Sip/LG5、Sip/LD11、Sip/Al-Si2O,3种可回收再利用的、高体积分数环保型复合材料，探讨了Sip/Al复合材料导电性能的影响因素，并采用理论模型对复合材料电导率进行了理论计算。结果表明，Sip/Al复合材料导电率可达4．42MS/m；Si-A1界面平直、干净、没有反应物产生；基体合金相同时，复合材料的电导率随着增强体颗粒含量增加而下降；颗粒含量相同时，电导率随着基体中合金元素量增加而下降；颗粒大小对电导率影响不明显；复合材料经过退火处理后电导率有所升高。与复合材料电导率的实测值相比较，P.G模型的计算结果和测量值比较接近。The Sip/LG5, Sip/LD11、 Sip/Al-Si2O environmental-friendly composites for electronic packaging applications with large content of Si particles were fabricated by squeeze-casting technology. The effects on the electrical conductivity properties of composites were discussed, also with the electrical conductivity calculated by theoretical models. Results show that the measured electrical conductivity of the Sip/Al composite was 4.42 MS/m. the Sip/Al interfaces are clean without interface products. The electrical conductivity of composites decrease with the increasing content of Si particles, the effect of Si content in the matrix alloy is the same to above regularity. Particles size has not evident effects on electrical conductivity. Electrical conductivity of composites increases slightly after annealing treatment. The electrical conductivity of composites calculated by P.G model is coincidence to above tests.

关 键 词：SIP/AL复合材料 界面 电导率 电子封装 

分 类 号：TB331[一般工业技术—材料科学与工程]