JF04F18型SMD管壳微波设计  

Microwave Performance Design of JF04F18 SMD Package

作　　者：涂传政[1] 崔帼艳[1] 李海波[1] 

机构地区：[1]中电科技集团第五十五研究所,南京210016

出　　处：《电子与封装》2007年第11期13-17,共5页Electronics & Packaging

摘　　要：作为微波电子元器件的重要组成部分,封装外壳不仅起着安放、固定、密封、保护芯片和增强电热性能的作用,而且还是沟通芯片内部与外部电路的桥梁。随着微电子技术的发展,SMD外壳在微波器件封装上应用越来越广泛,文章以某GaAs单片封装用SMD外壳的微波设计为例,简要介绍了其设计思路与过程。通过仿真数据与实测对比得到结论,合理使用HFSS对封装外壳进行设计,可以有效提高微波管壳的研制效率。As the important parts of microwave electronic apparatus, the package not only has the ability of emplace, fastness, airproof, protect chip and increase the galvanothermy capability, but also to be the bridge to contact the chip inside and the outside circuit. SMD package is widely used in microwave device packaging with the development of microelectronic technology. This article briefly introduced the design method and process of microwave package with an example of certain GaAs FET package. By comparing between simulation data and measurement result author concluded that it is more efficient to use the software HFSS in package design.

关 键 词：SMT HFSS 管壳设计 

分 类 号：TN305.94[电子电信—物理电子学]