无铅焊膏用助焊剂活性物质的研究  

Study on active substance of flux for lead-free solder paste

作　　者：李国伟[1] 雷永平[1] 夏志东[1] 史耀武[1] 张冰冰[1] 

机构地区：[1]北京工业大学材料学院先进电子连接材料试验室,北京100022

出　　处：《电子元件与材料》2007年第12期43-46,共4页Electronic Components And Materials

基　　金："十一五"国家科技支撑计划重点资助项目(替代含铅材料的系列产品开发及产业化);北京市属高等学校人才强教计划资助项目;北京市教育委员会资助项目(2002KJ020)

摘　　要：选择几种常用活性剂进行铺展面积和润湿力性能测试,对效果较好的活性剂进行复合处理;采用铺展试验优化,模拟实际回流焊工艺进行性能测试,得到了一种较好的助焊剂。结果表明:当A酸、B酸和C酸的复合质量比为2:4:1,加入质量分数约0.56%的三乙醇胺时,溶液的pH值约为3.80,钎料焊后的扩展率可接近80%。由此配制的焊膏焊接性能良好,腐蚀性小,焊后残留量低,存储寿命较长。The properties of spreadability and wetting power with some active agent were tested according to the industry standard. The better active agent was chosen for compounding; the component of the flux was optimized by using spreadability experimental, and the reflow-soldering was simulated in the practice. The result shows that when the proportion by mass of organic acid A and organic acid B and organic acid C is 2：4：1, add in about 0.56% triethanolamine, the pH value of the flux is 3.80 approximately, the rate of expansion of solder after soldering is nearly 80%, the flux is good welding performance and a long storage life, and it is non-corrosive, the less corrosion of components.

关 键 词：电子技术 活性剂 铺展性 润湿力 助焊剂 

分 类 号：TN604[电子电信—电路与系统]