Cu底层对SmCo薄膜磁性能的影响  

Effect of Cu underlayer on magnetic properties of SmCo thin films

作　　者：张峰[1] 黄致新[1] 胡曾[1] 崔增丽[1] 董凯峰[2] 杨晓非[2] 

机构地区：[1]华中师范大学物理科学与技术学院,武汉430079 [2]华中科技大学电子科学与技术系,武汉430074

出　　处：《华中师范大学学报（自然科学版）》2007年第4期543-545,共3页Journal of Central China Normal University：Natural Sciences

基　　金：国家自然科学基金资助项目(60571010);湖北省自然科学基金资助项目(2005ABA041).

摘　　要：通过多靶射频磁控溅射系统在玻璃基片上制备了SmCo/Cu磁性薄膜.采用控制变量法优化了磁性层溅射工艺参数,制备出了矫顽力高达2400 Oe的溅射态SmCo面内磁化膜;通过控制溅射Cu底层时的基片温度,薄膜磁化方向有从面内向垂直方向转变的趋势,并制备出矫顽力达到6215 Oe的垂直面内方向的SmCo/Cu薄膜;利用扫描隧道显微镜(STM)分析SmCo薄膜在不同温度下的表面形貌发现,150℃时薄膜的晶粒尺寸较小有利于改善薄膜磁性能.SmCo/Cu magnetic thin films were prepared on glass substrates by RF magnetron sputtering system. The sputtering parameters of the magnetic thin films were optimized by the parameter control method and the SmCo thin films with coercivity up to 2400 Oe that in the plane direction were obtained. By controlling the temperature of Cu underlayer,the magnetization orientation of the films changed from in-plane to perpendicular and the coercivity up to 6215 Oe for SmCo/Cu thin films were fabricated. The STM images revealed that SmCo/Cu thin films possess better magnetic properties with Cu underlayer at 150℃.

关 键 词：Cu底层 磁控溅射 SmCo薄膜 矫顽力 

分 类 号：TM273[一般工业技术—材料科学与工程]