硅/玻璃紫外固化中间层键合  

Intermediate Layer Bonding for Silicon and Glass Based on UV Adhesive

作　　者：程文进[1] 汤自荣[1] 廖广兰[1] 史铁林[1] 林晓辉[1] 彭平[1] 

机构地区：[1]华中科技大学机械科学与工程学院

出　　处：《Journal of Semiconductors》2008年第1期179-182,共4页半导体学报（英文版）

基　　金：国家重大基础研究发展规划(批准号:2003CB716207);国家自然科学基金(批准号:50405033)资助项目~~

摘　　要：利用玻璃的透光特性和紫外固化的成熟技术,研究了一种使用紫外固化胶作为中间层的玻璃/硅室温键合工艺.通过选择一定波段的紫外固化胶,旋涂紫外胶后使用365nm光刻机作为紫外光源控制紫外固化,从而实现了硅/玻璃的中间层键合.分析测试结果表明,紫外固化辅助的中间层键合可以成功应用于硅/玻璃键合,中间层厚5～6μm,键合强度达到26MPa.该工艺只需室温条件,简单高效,成本低廉,无需额外的压力或电场,对于硅/玻璃低温键合封装具有潜在的应用价值.Taking advantage of the transparency of glass and the maturity of UV curing technology, an intermediate layer bonding process with ultraviolet curable adhesive was investigated to bond silicon wafer to glass substrate. Following the spin-coating of UV- curable adhesive onto the wafer,the silicon wafer and glass substrate were bonded under UV light with a wavelength of 365nm. Ex- perimental results demonstrate that the UV curing approach can be applied in the silicon-glass intermediate layer bonding. The bond- ing strength can reach over 26MPa and the thickness of the intermediate layer is about 5-6μm. The process is effective,simple, and low cost,and it will have potential applications in low-temperature microelectronics packaging.

关 键 词：室温键合 中间层 紫外固化 

分 类 号：TN405[电子电信—微电子学与固体电子学]