弱酸性电镀Sn-Ag-Cu合金及镀层焊接性能的研究  

Study of Electroplating Process in Weak Acid Bath and Soldering Properties of Sn-Ag-Cu Alloy

作　　者：张锦秋[1] 安茂忠[1] 刘桂媛[1] 于文明[1] 

机构地区：[1]哈尔滨工业大学应用化学系,黑龙江哈尔滨150001

出　　处：《电镀与环保》2008年第1期8-11,共4页Electroplating & Pollution Control

摘　　要：对弱酸性甲磺酸盐-碘化物电镀Sn-Ag-Cu合金工艺进行了优化,镀层光亮、致密、平整,阴极电流效率提高到25%左右。Sn-Ag-Cu合金镀层耐蚀性好;部分Sn-Ag-Cu合金镀层在高温高湿条件下有锡须产生;回流焊后Sn-Ag-Cu合金镀层与Sn-3.0Ag-0.5Cu焊料间结合牢固。The electroplating process for Sn-Ag-Cu alloy coatings in weak acid bath is optimized. The coatings obtained from the baths containing methylsulfonate, iodide, complexing agents and some organic additives are bright, dense and smooth, and the cathode current efficiency is raised to about 25%. Sn-Ag-Cu alloy coatings have excellent corrode resistance. Tin whiskers will grow on some Sn-Ag-Cu alloy coatings surfaces under high temperature and high humidity conditions. Binding force of Sn-Ag-Cu alloy coatings and Sn-3.0Ag-0.5Cu solder is strong.

关 键 词：电镀 Sn—Ag—Cu合金 无铅镀层 焊接 

分 类 号：TQ153[化学工程—电化学工业]