无铅汽相焊接工艺研究  

Investigation on the Lead-Free Process of Vapor Phase Soldering

作　　者：李元山[1] 李德良[2] 

机构地区：[1]国防科技大学计算机学院,湖南长沙410073 [2]中南林业科技大学材料与化工学院,湖南长沙410004

出　　处：《计算机工程与科学》2008年第2期156-158,共3页Computer Engineering & Science

摘　　要：采用自行研制的低熔点Sn-Bi-X合金作为焊料,对高热容量的印制板进行汽相焊接,圆满解决了高温型无铅回流焊接中难以克服的各种焊接故障。针对回流焊出现的问题,作者特别设计了一种含有低热容量0402元件和大尺寸高热容量BGA芯片的20层试验板,充分利用汽相焊炉独有的SVP功能对温度曲线进行精确控制,使各种元器件的引脚在焊接过程中始终保持热匹配,避免了小热容量器件的过焊接和大热容量器件的冷焊现象。A high-heat-capacity printed circuit board （PCB） is soldered in the vapor phase soldering process by using the self-made low melting point Sn-Bi-X alloy as a solder. Various insurmountable soldering defects in the high-temperature lead-free fellow soldering process are successfully resolved. Aiming at the problems occurred in the reflow process, a test board of 20 layers containing the 0402 chips with low-heat-capacity and large-sized BGA chips with high heat capacity is specially designed by the authors. The temperature profile can be accurately controlled by using the particular SVP function of the vapor phase process, the leads of various chips can keep the heat matched all the time while they are being soldered. Therefore, the excessive soldering phenomena of low-heat-capacity chips and the cold soldering phenomena of high-heat-capacity chips are avoided.

关 键 词：无铅焊 汽相焊 回流焊 焊接故障 高热容量印制板 

分 类 号：TG406[金属学及工艺—焊接]