热超声倒装键合中基于视觉的芯片高精度定位控制  

Vision Based High Precision Positioning of Chips in Thermosonic Flip-chip Bonding

作　　者：周海波[1] 邓华[1] 段吉安[1] 

机构地区：[1]中南大学,长沙410083

出　　处：《中国机械工程》2008年第4期432-435,共4页China Mechanical Engineering

基　　金：国家自然科学基金资助重大项目(50390064)

摘　　要：针对自行研制的热超声倒装芯片键合机,建立了基于视觉的芯片定位控制系统,运用图像识别及处理算法对芯片的位置进行实时检测,并结合PID控制方法实现了平台的精确位置控制。实验结果表明,基于视觉的芯片定位控制系统能很好地完成芯片与基板的高精度键合定位。A vision based chip positioning system was built for the self-developed thermosonic flip-chip bonding machine that consisted of a vision system and motion platforms. The chip position was given by the vision system and the motion platform was controlled by PID controller. Experimental results show that precision positioning between the chip and the substrate can be achieved by using the designed vision based positioning system.

关 键 词：热超声倒装键合 视觉系统 运动控制 芯片 

分 类 号：TN405[电子电信—微电子学与固体电子学]