FCOB器件在热循环载荷下的界面层裂研究  

Study on interfacial delamination of FCOB under thermal cycle loading

作　　者：苏喜然[1] 杨道国[1] 赵鹏[1] 郭丹[1] 

机构地区：[1]桂林电子科技大学机电工程学院,广西桂林541004

出　　处：《电子元件与材料》2008年第1期62-64,共3页Electronic Components And Materials

基　　金：国家自然科学基金资助项目(60666002)

摘　　要：界面层裂是塑封半导体器件的主要失效模式之一。采用通用有限元软件MSC.MARC,研究了FCOB(基板倒装焊)器件在热循环(–55^+125℃)载荷作用下,底充胶与芯片界面的层裂问题。结果表明:底充胶与芯片界面最易出现分层,分层扩展的位置都在该界面的边缘拐角处;如果分层导致底充胶开裂,开裂的方向大约是35°。Interface delamination is one of the major failure mode in plastic IC packages. Delamination at the underfill/chip interface in a flip chip on board （FCOB） assembly was investigated through MSC.MARC software under a thermal cycle （-55-125℃） loading. The results show that the potential sites of delamination and propagation of delamination at the underfill/chip interface are the fringe comer of this interface. Besides, it is also found from simulation that once underfill cracking is induced by the delamination, the cracking is about along the direction of 35°.

关 键 词：电子技术 基板倒装焊器件 底充胶 热循环 界面层裂 

分 类 号：TN406[电子电信—微电子学与固体电子学]