空调器印刷电路板无铅焊点抗热疲劳性能分析  

Thermal Fatigue Analysis for Lead-free Solder Joint of Air-conditioner PCB

作　　者：李晓延[1] 严永长[1] 刘功桂 陈伟升 刘彦宾 夏庆云 王玲 

机构地区：[1]北京工业大学,北京100022 [2]广州威凯检测技术研究所,广州510300

出　　处：《失效分析与预防》2008年第1期64-68,共5页Failure Analysis and Prevention

摘　　要：随着对环境保护的重视,电子产品的无铅化已经势在必行。本文对空调器印刷电路板(PCB)通孔插装形式无铅焊点的热疲劳寿命进行了研究。采用有限元的方法,应用基于蠕变应变的Syed寿命模型,计算了在热疲劳状态下空调印刷电路板的寿命。通过加速寿命的实验方法,在相同温度循环条件下测试了各种型号空调印刷电路板中无铅焊点的寿命。所得的试验结果与理论计算基本吻合,验证了采用有限元模拟技术与Syed寿命模型计算空调器印刷电路板通孔插装形式无铅焊点寿命的可行性。With attaching important to environment, the lead-free of electronic production is imperative under the situation. Thermal fatigue life of lead-free solder joint of Air-conditioner PCB （Printed Circuit Board） under the form of THT（Through Hole Technology） is studied. Based the Syed creep strain life model and FEM（ Finite Element Method）, the life of Air-conditioner PCB is calculated. Through the method of speeding up life, the life of all types of air-conditional PCB non-lead solder jointed is tested under same temperature cycles. The result through calculating is similar to the result of test. That means adopting FEM and Syed model to calculate the life of lead-free THT solder joints in Air-conditioner PCB is feasible.

关 键 词：可靠性 通孔插装 无铅焊料 热循环 有限元 

分 类 号：V215.54[航空宇航科学与技术—航空宇航推进理论与工程]