带金属密封环的AlSiC管壳制备与性能  

Fabrication and Property of Aluminum Silicon Carbide Packaging Housing with Metal Seal Ring

作　　者：熊德赣[1] 杨盛良[1] 白书欣[1] 卓钺[1] 赵恂[1] 

机构地区：[1]国防科技大学航天与材料工程学院,长沙410073

出　　处：《电子与封装》2008年第3期14-17,21,共5页Electronics & Packaging

摘　　要：采用模压成形制备预制件，经真空-压力浸渗后成功制备出带金属密封环的A1SiC管壳，评价了带密封环的A1SiC管壳的性能当磷酸铝含量为1．2％，成形压力为200MPa，800℃恒温2h处理的SiC预制件抗弯强度为12．4MPa，孔隙率为37％。A1SiC电子封装材料在100℃～500℃区间的热膨胀系数介于（6．52-7．43）×106℃^-1，热导率为160W·m^-1·K^-1，抗弯强度为380MPa，漏率小于1．0×10^-9 Pa·m^3·s^-1、无任何约束条件下，A1SiC管壳升温至450℃．恒温90min，然后随炉冷却，密封环为铝合金的管壳明显变形，与有限元分析结果相符，而密封环为4J45的管壳基本朱变形。4J45密封环与铝合金扩散形成（Fe，Ni）Al3，但4J45密封环与A1SiC壳体间界面结合不紧密，导致A1SiC管壳漏率大于1×10^-8Pa·m^3·s^-1。Aluminum silicon carbide packaging housing with metal seal ring can be produced successfully by combination of compression molding for SiC preform and vacuum pressure infiltration. The properties of A1SiC electronic packaging materials were evaluated. The results show that bending strength and porosity of SiC perform was 12.4MPa, 37% respectively when the content of aluminum phosphate was 1.2%, molding pressure was 200 MPa and were dried at 800℃ for 2 hours. The properties of A1SiC electronic packaging material are as follows：The coefficient of thermal expansion is ranged （ 6.52-7.43 ） × 10^-6℃^-1 from 100℃ to 500℃,the thermal conductivity is 160 W·m^-1·K^-1,bending strength is 380MPa and the hermeticity is less than 1.0×10.9 Pa·m^3·s^-1. The A1SiC packaging housing with aluminum seal ring was distorted evidently, which agree with the result predicted by finite element analysis , while one with 4J45 seal ring was not distorted when they were exposed at 450℃ for 90 minutes without any restraint conditions. The intermetallic compound of （ Fe,Ni ） A13compound was formed between 4J45 seal ring and aluminum. The hermeticity of A1SiC packaging housing using 4J45 alloy as seal ring was more than 1×10^-8 Pa·m^3·s^-1 because the interface between seal ring and A1SiC material was not dense joint.

关 键 词：A1SiC封装材料 管壳 真空压力浸渗 密封环 有限元分析 

分 类 号：TG146[一般工业技术—材料科学与工程]