石墨粉化学镀铜工艺的研究  

Electroless Copper Plating Technology for Graphite Powder

作　　者：沈丽霞[1] 

机构地区：[1]沈阳理工大学环境与化工学院,辽宁沈阳110168

出　　处：《电镀与精饰》2008年第4期8-10,共3页Plating & Finishing

摘　　要：为解决受电弓滑板制造过程中的Cu／C界面问题，以硫酸铜为主盐，锌粉为还原剂，利用化学镀的方法在石墨粉表面镀覆铜层。研究了主盐、冰乙酸质量浓度、镀覆温度和时间等因素对化学镀铜的影响。实验结果表明，在硫酸铜质量浓度为60g／L、锌粉24g／L、冰乙酸14～18mL／L、镀覆时间为40min、温度为35℃的条件下得到的镀层均匀、致密且与石墨粉呈锯齿状紧密结合。Electroless plating method was employed to deposit copper on graphite surface in order to solve the Cu/C interface problem in pantograph slide manufacture, where bluestone is used as the solute and zinc powder as the reductant. The influence factors （solute concentration, acetic acid concentration, temperature and reaction time） were investigated. The experiment indicates that the Cu coating, prepared by the electroless plating, is uniform, dense and integrated well with graphite surface （sawtooth-like interface） when the conditions of bluestone concentration 60 g/L, Zinc 24 g/L, acetic acid 14 -18 mL/L, deposition time 40 min, deposition temperature 35℃.

关 键 词：化学镀铜 石墨粉 受电弓滑板 

分 类 号：TQ153.14[化学工程—电化学工业]