离子注入辅助Al_2O_3陶瓷表面化学镀镀层特性研究  

Study on characteristics and technology of ion implantation-assisted electroless copper plating films on Al_2O_3 ceramics

作　　者：王晓虹[1] 孙智[1] 王德奎[1] 刘明[1] 

机构地区：[1]中国矿业大学材料科学与工程学院,江苏徐州221116

出　　处：《材料热处理学报》2008年第2期150-153,161,共5页Transactions of Materials and Heat Treatment

基　　金：江苏省自然科学基金(DK2004032);中国矿业大学青年基金(2005A046)

摘　　要：用金属离子源在96Al2O3陶瓷表面注入不同能量和剂量的Ni离子,然后在镀液中进行化学镀铜。用扫描电镜、卢瑟福背散射能谱和X光电子能谱技术对注入层和镀层进行分析研究。结果表明:Ni离子注入可作为一种新的活化工艺,辅助Al2O3陶瓷化学镀铜;注入参数对后续化学镀覆有显著影响,注入获得表面Ni浓度高的镀覆效果较好,应选用低能量进行高剂量注入;试验条件下优选工艺参数为15keV,2.2×1017ions/cm2,该条件下开始化学镀铜的孕育期仅为45s,镀速达到52.43nm/min,镀层表面粗糙度为0.317μm,所得化学镀铜层均匀、致密,与基体结合紧密。The 96Al2O3 ceramics was implanted with Ni ion to different dosages and energies using a metal vapour vacuum arc（MEVVA） ion source,and then the ceramics was fabricated to metallic structure by selective electroless copper plating. The characteristics and microstructure of the plating layer were studied using the scanning electronic microscope（SEM）,Rutherford backscattering energy spectrometer（RBS）and X-ray photoelectron spectrograph（XPS）.The results show that implanting Ni ions can catalyze electroless copper plating on the ceramics surface.The activation effect on the electroless copper plating depends on the implantation parameters,and low energy and high dosage should be selected.The optimum parameters of energy 15keV and dosage 2.2×10^17ions/cm^2 are obtained based on experiments.By this technology,the incubation period of electroless copper plating is only 45s,the plating velocity is 52.43nm/min,the surface roughness of plating layer is 0.317μm,and well-distributed and fine microstructure of the plating is observed.

关 键 词：离子注入 AL2O3 活化 化学镀铜 

分 类 号：TG174.41[金属学及工艺—金属表面处理]