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作 者:曾超[1] 王春青[1] 田艳红[1] 孔令超[1]
机构地区:[1]哈尔滨工业大学材料科学与工程学院微连接研究室,哈尔滨150001
出 处:《宇航材料工艺》2008年第2期60-64,68,共6页Aerospace Materials & Technology
摘 要:描述了氧化铝陶瓷封装制造中热切缺陷的产生,并利用扫描电子显微镜及表面粗糙度测量仪对热切表面的表面质量进行了评价。为了进一步的评价热切缺陷对陶瓷元件可靠性的影响,引入W eibull强度统计理论,比较了自然表面和热切表面的强度差异。实验结果表明,热切表面的表面质量明显差于自然表面;同时热切缺陷存在使氧化铝陶瓷试样强度显著下降,强度分散度增加;试样尺寸减小时,热切缺陷使陶瓷元件可靠性更低。This paper describes the hot-cutting defect generated in alumina ceramic packaging manufacturing process. The scanning electron microscope was utilized and the surface roughness was measured to estimate the surface integrity of the hot-cutting surface. To investigate the impact of hot-cutting defect on the strength of alumina ceramic, Weibull statistic was introduced to compare the strength of natural surface and hot-cutting surface. Experiment indicates that the surface integrity is worse than that of the natural surface, the hot-cutting defect resulted in a remarkable decline in strength and the variability of strength become high. For little ceramic components, the reliability is more sensitive to hot-cutting defect.
分 类 号:TQ174.758[化学工程—陶瓷工业] O422[化学工程—硅酸盐工业]
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