崭露头角的系统封装  

SIP of the Visible

作　　者：林金堵[1] 

机构地区：[1]CPCA

出　　处：《印制电路信息》2008年第5期9-12,共4页Printed Circuit Information

摘　　要：文章概述了系统封装(SIP)的概念、特点和问题点。着重指出,系统封装(SIP)是由MCM和MCP深入发展和改革而发展起来的。系统封装(SIP)技术是电子产品的组装技术和走向微小型化的未来。The paper describes that the characterization and problem of SIP.It is indeed the rebirth of a concept that has been with us for many years, first as MCM and then as MCP. SIP is indeed the feature of the assembly and the micro-miniaturization in electronic products.

关 键 词：系统封装 多芯片模块 多芯片封装 系统功能 确认好的裸芯片 

分 类 号：TN41[电子电信—微电子学与固体电子学]