磁控溅射抗EMI金属膜的研究  

On the anti-EMI metal thin films deposited by magnetron sputtering

作　　者：陈省区[1] 王德苗[1] 赵欢畅[1] 任高潮[1] 

机构地区：[1]浙江大学信电系,浙江杭州310027

出　　处：《真空》2008年第3期40-43,共4页Vacuum

摘　　要：首先对金属屏蔽的机理以及Schelkunoff电磁屏蔽理论进行了分析,然后采用磁控溅射的方法在PET塑料上沉积了Cu/1Cr18Ni9Ti,并采用波导的方法对样品的屏蔽效能进行了测试。研究表明:单次反射损耗对屏蔽效能的贡献最大,双面金属膜层比单面金属膜层具有更高的屏蔽效果。Discusses the electromagnetic shielding mechanism of metal films and Schelkunoff electromagnetic shielding theory. Then, the Cu/1Cr18Ni9Ti metal thin films were deposited on the PET plastic as substrate by magnetron sputtering, and the shielding effectiveness of the samples was tested by means of waveguide. The results showed that the single reflection loss is the dominant contributing factor to shielding effectiveness （SE） and that the double-side metal films have a better SE than single- side ones.

关 键 词：电磁屏蔽 磁控溅射 屏蔽效能 塑料基底 

分 类 号：TG132[一般工业技术—材料科学与工程] TB43[金属学及工艺—合金]