微器件用Ni-W合金薄膜热稳定性的研究  

Study of heat stability of Ni-W alloys film for micro-devices

作　　者：刘瑞[1] 汪红[1] 姚锦元[1] 李雪萍[1] 丁桂甫[1] 赵小林[1] 

机构地区：[1]上海交通大学微纳科学技术研究院薄膜与微细技术教育部重点实验室微米/纳米加工技术国家级重点实验室,上海200030

出　　处：《功能材料》2008年第2期220-223,226,共5页Journal of Functional Materials

基　　金：国家高技术研究发展计划(863计划)资助项目(2006AA4Z326);上海市科学技术委员会科技攻关资助项目(051111022)

摘　　要：研究了低应力柠檬酸胺-1-羟基乙烷二膦酸(HEDP)镀液体系中电流密度、pH值、脉冲参数和热处理条件等对Ni-W合金薄膜硬度的影响。结果表明,电镀工艺条件对硬度提高有限,热处理对Ni-W合金薄膜的硬度有明显提高。同时研究对比了沉积态及550℃热处理后Ni和Ni-W硬度、干摩擦条件下耐磨性以及微观结构的变化。实验发现:多晶的Ni薄膜经过热处理后,晶粒尺寸显著长大,硬度、耐磨性约下降2/3;而Ni-W合金薄膜经过热处理后,微观结构由非晶转变成纳米晶,薄膜仍保持良好的耐磨性,硬度提高了1倍。Ni-W合金薄膜优异的热稳定性,有望在特殊环境下取代Ni薄膜在MEMS器件上获得应用。This paper introduces the effect of current density,pH,pulse parameter in the system of citrate amine-HEDP and heat treatment on the hardness of Ni-W alloy films.The results show that electrodeposition conditions improve hardness slightly,and heat processing can increase hardness obviously while wear resistance has little change.We also study hardness,wear resistance in dry friction condition and variation of micro-structure of electrodeposited and heat treated Ni and Ni-W alloy films.It is concluded that grain size increase dramatically,hardness and wear resistance of Ni film decrease by twothirds after heat treatment.However,the heat treated Ni-W alloy films still has high hardness and wearing resistance because of change of microstructure.Therefore,Ni-W alloy films could replace Ni film in MEMS devices with special conditions due to its good thermal stability.

关 键 词：NI-W合金 电沉积 热稳定性 薄膜结构 热处理 

分 类 号：TQ153.2[化学工程—电化学工业] TG113.2[金属学及工艺—物理冶金]