SnAgCu无铅钎料元素浸出行为研究  

Leaching of Elements from Lead-Free Sn-Ag-Cu Solder Alloy

作　　者：樊志罡[1] 赵杰[1] 孟宪明[1] 马海涛[1] 王来[1] 

机构地区：[1]大连理工大学材料科学与工程学院,辽宁大连116024

出　　处：《材料保护》2008年第6期5-7,共3页Materials Protection

摘　　要：对常用的Sn-3.5%Ag-0.5%Cu无铅钎料及Sn-3.5%Ag-0.5%Cu/Cu焊接接头在H2SO4、NaOH、HNO3和NaC l溶液中进行了元素浸出试验,研究电子产品中重金属元素在不同环境中的浸出行为,从而分析电子产品的掩埋对土壤和地下水污染情况及如何合理选择填埋场所。结果表明,在不同环境中SnAgCu无铅钎料及其钎焊接头的各金属元素浸出行为有较大差别。对于SnAgCu钎料而言,对Sn的浸出量影响最大的是C l-,对Ag的浸出量影响最大的是SO24-,各溶液对Cu的浸出量影响不大;就SnAgCu/Cu焊接接头而言,对Sn和Cu的浸出量影响最大的是OH-,而对Ag的浸出量影响最大的是C l-。因此,一般掩埋Sn-3.5%Ag-0.5%Cu钎料最好的土壤应为酸性土壤,且土壤中C l-、SO24-不宜过高。Leaching tests were carried out for lead-free Sn-3.5Ag-0.5Cu solder alloy and Sn-3.5Ag-0.5Cu/Cu solder joint in aqueous solutions of H2SO4, NaOH, HNO3, and NaCl, aiming at revealing the leaching behavior of heavy metals from electronic wastes in different environments and exploring the pollution of electronic wastes to soils and ground water as well. The guidance to the selection of suitable burying environment for the electronic wastes was discussed. Results indicated that there exist great differences in the leaching behavior of heavy metals corroded in various media. Namely, for SnAgCu solder alloy, Cl- had the dominant effect on the leaching amount of Sn, while SO2-4 had the dominant effect on the leaching amount of Ag, but they had no effect on the leaching of Cu. As for SnAgCu/Cu solder joint, OH- had a key effect on the leaching behavior of Sn and Cu, while Cl- dominates the leaching amount of Ag. Therefore, it was imperative to bury Sn-3.5Ag-0.5Cu solder alloy in acidic soils containing small amounts of Cl- and SO2-4.

关 键 词：电子垃圾 无铅钎料 SNAGCU 浸出行为 

分 类 号：TG425[金属学及工艺—焊接]