振动式微机械隧道陀螺仪的制备工艺  

The Fabrication Process of Tunneling Vibratory Microgyroscopes

作　　者：王凌云[1] 孙道恒[1] 刘益芳[1] 

机构地区：[1]厦门大学机电工程系,福建厦门361005

出　　处：《传感技术学报》2008年第3期439-442,共4页Chinese Journal of Sensors and Actuators

基　　金：国家自然科学基金资助(50675184);福建省科技计划重点项目资助(2002H022);回国留学人员基金资助;厦门大学新世纪优秀人才基金资助

摘　　要：振动梁式微机械隧道陀螺仪是一种以悬臂梁作为换能构件,以电子隧道效应为输出敏感方式的高精度和高灵敏的角振动传感器,解决了传统机械陀螺仪因尺寸减小而导致的灵敏度降低的缺点。结合微机械隧道陀螺仪的尺寸特点:硅尖与下电极的距离为1μm,齿厚和齿间距之间的距离为4μm,梁的厚度为50μm,提出硅正面刻蚀—玻璃上电极制作—硅玻键合—硅背面减薄—硅背面刻蚀的DDSOG(DeepDrySiliconOnGlass)工艺方案,成功实现了整个器件的工艺制备。本文就DDSOG工艺中的关键工艺进行了一一论述,该工艺不仅能用于隧道陀螺仪的制备,同时也可以制作其它高深宽比传感器或执行器。Micro-machined tunneling gyroscope with cantilever is a kind of angular rate sensor with high sensitivity and resolution, in which cantilever works as transducer and electron tunneling effect is employed as sensor. It overcomes the traditional one＇s reduction in sensitivity when miniaturized. The Deep Dry Silicon On Glass （ DDSOG ） process , which includes the silicon front side etching , the technology of electrodes on the glass, the wafer bonding, the silicon thickness reduction and silicon deep etching on the back side, has been introduced to fabricate the microgyroscope based on its dimension characteristics： 1μm gap between silicon tip and its underside electrode, 4μm finger gap and width, 50μm thickness of cantilever. This process can be used to fabricate not only the micro-machined tunneling gyroscope but also other sensor and actuators.

关 键 词：微机械陀螺仪 隧道效应 DDSOG工艺 硅尖 

分 类 号：TP212[自动化与计算机技术—检测技术与自动化装置] V241.5[自动化与计算机技术—控制科学与工程]