4种常见牙本质黏结剂的边缘封闭性研究  

Study on marginal sealability of four dentin adhesive systems

作　　者：郭艳[1] 何惠明[1] 赵信义[1] 邹承蓉[2] 高锋[3] 

机构地区：[1]第四军医大学口腔医学院 [2]兰州军区机关门诊部口腔科 [3]云南省军区77332部队

出　　处：《牙体牙髓牙周病学杂志》2008年第5期285-288,共4页Chinese Journal of Conservative Dentistry

基　　金：国家自然科学基金资助项目(30470433)

摘　　要：目的:研究对比4种临床常用牙本质黏结剂的边缘封闭性。方法:12个离体前磨牙,在颊、舌侧牙颈部釉-牙骨质界处各制备直径2mm,深1.5mm盒型洞。随机分为4组,分别使用Single Bond、AdperPrompt、Clearfil SE Bond、Spread iBond黏结,3MZ250树脂充填。500g/L碱性硝酸银中浸泡24h,强光显影8h,沿牙体长轴通过充填体正中颊舌向纵行剖开,体视显微镜下观察各剖面充填体边缘的微渗漏情况,并以扫描电镜观察树脂-牙本质界面的结合状态。结果:各种黏结剂界面均存在微渗漏现象,实验组Single Bond、AdperPrompt、Clearfil SE Bond和Spread iBond渗漏深度分别为(777.23±120.13)μm、(930.12±130.10)μm、(240.33±120.53)μm、(640.12±170.23)μm。Clearfil SE Bond组银渗漏的深度明显低于其他组,(P<0.05),其他3组组间无显著性差异(P>0.05)。结论:临床上常用的4种黏结剂均不能避免牙本质黏结界面的渗漏,Clearfil SE Bond对牙本质的封闭性优于Adper Prompt、Spread iBond、Single Bond。AIM： To evaluate the marginal sealability of resin - dentin interface of four dentin adhesive systems. METHODS： Standard box type class -I cavity （2mm in diameter, 1.5mm in depth） preparations were made at the cemento - enamel junction on the bueeal and lingual surfaces. The preparations were randomly assigned to four groups according to the adhesive systems used （Single Bond, Adaper Prompt, Clearfil SE bond and Spread iBond）, and then restored with filling 3M 7-250 composite resin. At last all teeth were sectioned through the midline of the restoration and were observed under stereomicroscope. SEM micrographs were also made in order to observe the resin - dentin interface. RESULTS： All teeth presented microleakage at the dentin interface. The microleakage values of Clearfil SE（240.33 ± 120.53 ）μm were much lower than those of Single Bond （777.23 ± 120.13 ）μm, Adper Prompt （930.12 ± 130.10 ）μm, and Spread iBond（640.12 ± 170.23）μm （P 〈0.05 ）. There was no significant difference in the dentin microleakage among Single Bond, Adper Prompt and Spread iBond. CONCLUSION： Though microleakage can not be avoid,it is suggested that Clearfil SE Bonding possesses the best obturation capability among four bonding materials. [Key words]

关 键 词：牙本质 牙本质黏结剂 微渗漏 扫描电镜 

分 类 号：R783.1[医药卫生—口腔医学]