RCC与不同FR-4基板多次积层的性能研究  

Performance Study of Multiple Build-up Boards from RCC and Different FR-4 Substrates

作　　者：刘东亮[1] 

机构地区：[1]广东生益科技股份有限公司,广东东莞523039

出　　处：《印制电路信息》2008年第6期17-19,共3页Printed Circuit Information

摘　　要：通过DOE应用试验,考察对比涂树脂铜箔(RCC)与不同FR-4半固化片制作高密度互连(HDI)板的多次层压性能,评估RCC相对FR-4半固化片的性能水平,为我们掌握不同材料多次层压制作HDI的表现、RCC与不同产品的组合使用及RCC产品配套开发提供参考依据。Through DOE experimentation, we studied and analyzed performance of HDI printed circuit board fabricated with RCC and different FR-4 prepreg. So we can evaluated difference of RCC and different FR-4 preperg. We can know how to select RCC or prepreg to fabricate HDI printed circuit board. It is reference for development of RCC production.

关 键 词：涂树脂铜箔 FR-4半固化片 高密度互连 

分 类 号：TN41[电子电信—微电子学与固体电子学]