混合集成电路内部多余物的控制研究  

Redundant Object Control of Hybrid Integrated Circuits

作　　者：刘晓红[1] 常青松[1] 

机构地区：[1]中国电子科技集团公司第十三研究所,石家庄050051

出　　处：《半导体技术》2008年第7期575-577,共3页Semiconductor Technology

摘　　要：分析了混合集成电路的内部多余物引入的途径,重点分析和阐述了金属空腔管壳在储能焊封装过程中金属飞溅物形成的原因。通过封装设备和工艺参数的控制以及管座和管帽设计的优化改进,有效控制了金属飞溅物进入封装腔体内部,提高了混合集成电路颗粒碰撞噪声检测(PIND)合格率以及产品的可靠性。The ways lead to redundant object in hybrid integrated circuit were analyzed, and the causes resulted in metal spatter of metal cavity package during the stored energy welding process were presented. The procedure used to prevent metal spatter flying into package cavity was controlled effectively by controlling the package equipment and procedure parameter, optimizing design of base and cap of package. The quality rate of hybrid IC PIND （particle impact noise detection） and reliability of products were improved.

关 键 词：混合集成电路 多余物 可靠性 颗粒碰撞噪声检测 

分 类 号：TN402[电子电信—微电子学与固体电子学] TN306