主盐浓度和工艺条件对Sn-Ag-Cu合金镀层组成和形貌的影响  

Effect of Concentrations of Main Salts and Process Conditions on Compositions and Morphologies of Sn-Ag-Cu Alloy Electrodeposits

作　　者：张锦秋[1] 安茂忠[1] 常立民[1] 刘桂媛[1] 

机构地区：[1]哈尔滨工业大学应用化学系,哈尔滨150001

出　　处：《无机化学学报》2008年第7期1056-1061,共6页Chinese Journal of Inorganic Chemistry

基　　金：哈尔滨市科学技术委员会科技攻关项目(No.2005AA5CG156)资助

摘　　要：在弱酸性镀液中电沉积得到无铅Sn-Ag-Cu可焊性合金镀层。采用X射线荧光光谱仪(XRF)和扫描电子显微镜(SEM)研究了镀液中主盐浓度和电镀工艺条件对镀层的组成和形貌的影响。研究表明,Sn-Ag-Cu合金的电沉积是正则共沉积。镀液中Sn2+和Ag+浓度改变对镀层晶粒大小影响较大,Cu2+浓度的改变对镀层的平整度影响较大。电流密度增加、pH值下降、温度降低,都能使镀层结晶细致。Lead-free Sn-Ag-Cu solder alloy electrodeposits were electrodeposited in weakly acidic baths.The effect of the concentrations of main salts and the process conditions on the compositions,and the morphologies of Sn-Ag-Cu alloy electrodeposits were investigated by X-ray fluorescence（XRF） and scanning electron microscopy（SEM）.The results indicate that,the electrodeposition of Sn-Ag-Cu alloy is canonical co-electrodeposition.The concentrations of Sn^2＋ and Ag^＋ have influence mainly on the grain size,while the concentration of Cu^2＋ has influence mainly on the planeness of the deposits.The increase of the current density,or the decrease of the pH value or the descent of the bath temperature can accelerate the growth of fine grains in the deposits.

关 键 词：Sn-Ag-Cu合金 可焊性镀层 电沉积 无铅 

分 类 号：O614.432[理学—无机化学] O614.12[理学—化学]