微电子封装界面强度的复合模式弯曲测试  

Mixed mode bending test for interfacial strength in microelectronic packages

作　　者：叶安林[1] 秦连城[1] 

机构地区：[1]桂林电子科技大学机电工程学院,广西桂林541004

出　　处：《电子元件与材料》2008年第8期59-61,共3页Electronic Components And Materials

摘　　要：设计了一种复合模式界面开裂测试装置,通过改变加载臂长来实现作用在试样裂纹尖端的不同应力模式。以试验测得的临界载荷及对应位移、裂纹扩展长度为条件,建立与测试装置对应的有限元模型,计算裂纹尖端模式角及在此模式角下的临界能量释放率。结果表明,装置所测试的模式角为7°～78°,以此为参数,可预测微电子封装界面强度。A setup was designed which was used mixed mode delamination testing for interface strength, where changing the loading arm to achieve the different mode mixity of a crack tip stress. Critical load and relevant crack length and displacement data from these experiments were used in a finite element model to calculate the crack tip mode angles, and corresponding critical energy release rate. The result shows the mode angle is 70-78° in the setup testing, and interface strength in microelectronic package can be predicted by the mode angles as parameters.

关 键 词：电子技术 微电子封装 模式角 裂纹扩展长度 界面强度 

分 类 号：TM931[电气工程—电力电子与电力传动]