添加微量稀土对SnBi基无铅钎料显微组织和性能的影响  

Effects of trace rare earth on microstructure and properties of SnBi based lead-free solder brazed joint

作　　者：董文兴[1] 史耀武[1] 雷永平[1] 夏志东[1] 郭福[1] 李晓延[1] 

机构地区：[1]北京工业大学材料学院,100022

出　　处：《焊接》2008年第7期43-46,共4页Welding & Joining

基　　金：十一五国家科技支撑重点项目"含有毒有害材料元素材料替代技术(2006BAE03B02);北京市属市管高等学校人才强教计划资助项目"环境协调连接材料与加工技术"学术创新团队计划资助

摘　　要：研究了添加微量稀土对Sn58Bi基无铅钎料熔化温度、润湿性能、钎焊接头强度、高温时效前后IMC厚度的变化和显微组织的影响,并与添加一定量Ag对Sn58Bi钎料的试验结果做了比较。试验所用钎料为Sn58Bi,Sn58Bi0.5Ag,Sn58Bi0.1RE和Sn58Bi0.5Ag0.1RE,添加稀土为Ce基混合稀土。试验结果表明,添加微量稀土不仅抑制了Sn58Bi钎料高温时效引起的IMC的生长,而且细化了显微组织;微量稀土添加对钎料熔化温度没有明显影响,但能显著改善Sn58Bi钎料的润湿性能和接头强度,而且改善的程度优于添加微量Ag对Sn58Bi钎料的作用。The effects of trace rare earth on melting temperature, wetting property, strength of brazed joint, thickness of IMC after and before high temperature aging and microstructure of SnBi based lead-free solder brazed joint were investigated, which was compared with the experiments of SnBi based lead-free solder with addition of trace Ag. The experimental results show, the addition of trace RE can not only impress the growth of IMC caused by high temperature aging of Sn58Bi solder, but also refine its microstructure. The addition of RE has little effects on the melting temperature of the solder, but can significantly improve the wetting property of the solder and the strength of the brazed joint, and its improvement is better than that of trace Ag.

关 键 词：无铅钎料 Sn58Bi 稀土 显微组织 性能 金属间化合物 

分 类 号：TG425[金属学及工艺—焊接]