工序能力分析在半导体生产线的应用  

Application of Process Capability Analysis in Semiconductor Production Line

作　　者：徐岚[1] 黄磊[1] 陈亮[1] 贾新章[2] 

机构地区：[1]中国电子科技集团公司第二十四研究所,重庆400060 [2]西安电子科技大学微电子学院,西安710071

出　　处：《微电子学》2008年第4期514-516,共3页Microelectronics

摘　　要：在现代电子元器件的生产中,器件失效率已降至几十FIT。为了满足高质量和高可靠性元器件的生产要求,对各工序的工序能力指数的要求也随之提高。文章介绍了工序能力分析在半导体生产线上的实际应用。在工艺过程稳定受控条件下,采取各种措施,不断提高工艺的工序加工能力,满足高质量产品的加工需求。The device failure rate of modern electronic components has dropped to dozens of FIT. To satisfy the requirement for producing high quality and high reliability components, the demand for process capability index has been increasing. This paper introduces the actual application of process capability analysis in semiconductor production line. Under statistical process control state, the processing capacity has been continuously improving by taking various measures, and therefore the processing line meets the needs of processing hlgh-quality products.

关 键 词：统计过程控制 工序能力指数 半导体生产线 

分 类 号：TN305.5[电子电信—物理电子学] F406.2[经济管理—产业经济]