铁氧体基材上磁控溅射可焊性薄膜  

Magnetron Sputtering Weldability Thin Films Based on the Ferrites Parent Metal

作　　者：张晔[1] 胡江华[1] 

机构地区：[1]中国电子科技集团公司第38研究所,安徽合肥230031

出　　处：《新技术新工艺》2008年第8期83-84,共2页New Technology & New Process

摘　　要：通过比较铁氧体表面金属化的多种方式,详细介绍了磁控溅射法对铁氧体基材进行金属化处理的工艺过程,并对利用该工艺制备的金属复合膜层进行了性能测试。测试结果表明,该工艺完全能满足铁氧体微波器件的焊接性能要求。This paper compares many kinds of ways of ferrites surface metallization,and introduces in detail the technological process of magnetron sputtering method to carry on metallized processing to the ferrites parent metal,and carries on the performance test to the metal compound film that used this craft preparation. The results indicate that this craft definitely can satisfy the welding performance request of the ferrites microwave device.

关 键 词：铁氧体 磁控溅射 复合膜 

分 类 号：TB43[一般工业技术]