面向订单制造的晶圆复杂制造系统动态调度优化  

Dynamic Scheduling Optimization of Make-to-order Complex Wafer Manufacturing Systems

作　　者：郭永辉[1] 

机构地区：[1]郑州航空工业管理学院工业工程系,河南郑州450015

出　　处：《工业工程》2008年第4期118-121,共4页Industrial Engineering Journal

基　　金：高校博士点基金资助项目(20050252008)

摘　　要：针对晶圆制造系统的多重入特性,提出了层周期、逻辑层数等概念。借鉴物理学中振动理论的基本思想设计调度优化方法,当生产偏离预期的控制目标时,通过人为地施加作用力,即动态调整各产品的加工优先级,使各产品逐渐逼近预期控制目标,保证产品正常产出。进一步的仿真验证也说明了该调度优化方法能在提高订单准时交货率的同时缩短生产周期时间。In view of the multiple re-entrant characteristics of wafer manufacturing systems, this paper presents some concepts such as cycle time per layer and logical layer number. The vibration theory is eraployed to design a scheduling optimization method. When production conditions deviate from expected objectives, man-made forces are used to adjust the deviation. The processing priority for each product is dynamically adjusted to make the production conditions approach the expected objectives. It is concluded that the method not only improves on-time delivery, but reduces cycle time also.

关 键 词：晶圆 多重入 调度优化 

分 类 号：TP278[自动化与计算机技术—检测技术与自动化装置]