200nm Gate Length Metamorphic In_(0.52)Al_(0.48)As/In_(0.6)Ga_(0.4) As HEMTs on GaAs Substrates with 110GHz f_T  

200nm栅长In_(0.52)Al_(0.48)As/In_(0.6)Ga_(0.4)As MHEMTs器件(英文)

作　　者：黎明[1] 张海英[1] 徐静波[1] 付晓君[1] 

机构地区：[1]中国科学院微电子研究所,北京100029

出　　处：《Journal of Semiconductors》2008年第9期1679-1681,共3页半导体学报（英文版）

基　　金：the State Key Development Program for Basic Research of China(No.G2002CB311901);the Equipment Investigation Program in Advance(No.61501050401C);the Dean Fund of the Institute of Microelectronics,Chinese Academy of Sciences(No.O6SB124004)~~

摘　　要：200nm gate-length GaAs-based InAlAs/InGaAs MHEMTs are fabricated by MBE epitaxial material and EBL （electron beam lithography） technology. Ti/Pt/Au is evaporated to form gate metals. A T-shaped gate is produced using a novel PMMA/PMGI/PMMA trilayer resist structure to decrease parasitic capacitance and parasitic resistance of the gate. Excellent DC and RF performances are obtained and the transconductance （gm） ,maximum saturation drain current density （Joss）, threshold voltage （ VT）, current cut-off frequency （fT） , and maximum oscillation frequency （fmax） of InAlAs/ InGaAs MHEMTs are 510mS/mm,605mA/mm, -1.8V, 110GHz, and 72GHz, respectively.利用电子束光刻技术制备出200nm栅长GaAs基InAIAs/InGaAs MHEMT器件.Ti/Pt/Au蒸发作为栅极金属.同时为了减少栅寄生电容和寄生电阻,采用3层胶工艺,实现了T型栅.GaAs基MHEMT器件获得了优越的直流和高频性能,跨导、饱和漏电流密度、域值电压、电流增益截止频率和最大振荡频率分别达到510mS/mm,605mA/mm,-1.8V,110GHz及72GHz,为进一步研究高性能GaAs基MHEMT器件奠定了基础.

关 键 词：MHEMT INALAS/INGAAS electron beam lithography T-shaped gate 

分 类 号：TN386[电子电信—物理电子学]