热风整平助焊剂的研制  

Study on preparation of hot-air solder leveling soldering aid

作　　者：付彦文 

机构地区：[1]陕西省石油化工研究设计院,陕西西安710054

出　　处：《应用化工》2008年第9期1114-1116,共3页Applied Chemical Industry

摘　　要：以两性表面活性剂（自制）、光亮剂、消烟剂、活化剂及混合溶剂为原料，配制热风整平助焊剂。探讨组分配比对241-243℃热风整平后印制板焊盘、孔涂铅锡的光亮度、饱满度、红孔及烟大小等的影响。结果表明，助焊剂的最佳组成为两性表面活性剂65％，光亮剂6．5％，消烟剂0．9％，活化剂0．75％，其余为溶剂。焊盘、孔铅锡光亮、饱满、无红孔、烟小，达到印制电路板生产要求。Hot-air solder leveling soldering fluid was made from amphiprotic surface active agent, bright agent,antismoke agent, activating agent and component solvent. In 241 - 243 ℃, the effect of various component amount on PCB bonding pads which were treated by hot-air solder leveling, the brightness and fullness of lead-fin solder in hole, red-hole and exhaust smoke level were studied. The result showed that ： the best composition of soldering fluid were amphiprotic surface active agent is 65% ,bright is 6.5% ,an- tismoke agent is 0.9% , activating agent is 0.75% , the rest is solvent. Lead-tin solder on bonding pads and holes was bright and full, no red-hole, low exhaust smoke lever, which can meet the requirement of PCB produce.

关 键 词：印制电路板 热风整平 助焊剂 红孔 

分 类 号：TQ049[化学工程]