V型微通道热沉的加工与测试  

Process and test of V-shaped microchannel heat sink

作　　者：韩宾[1] 高杨[2] 王保安[2] 

机构地区：[1]西南科技大学信息工程学院,四川绵阳621010 [2]中国工程物理研究院电子工程研究所,四川绵阳621900

出　　处：《传感器与微系统》2008年第10期109-111,共3页Transducer and Microsystem Technologies

基　　金：国防基础研究计划资助项目(K1303060115);武器装备预研计划资助项目(51305070402)

摘　　要：基于MEMS技术的V型微通道冷却器具有低热阻、低流量,高效率以及体积小等特点,能够对激光二极管阵列和其他高功率密度器件进行快速、高效地散热,成为一种新型的散热方案。介绍了V型微通道热沉的加工工艺,并利用研制的V型微通道热沉样品,模拟热源加载,进行了测试热沉散热性能的试验。通过试验数据得到微通道热沉的面积热阻仅为0.054 3 K.cm2/W。The V-shaped microchannel based on MEMS technology has the advantages of low thermal resistance, low flow, high efficiency and small volume. This cooling scheme can dissipate heat from diode laser array and other high power density devices quickly and effectively. V-shaped microchannel has become a new type cooling scheme. The process of V-shaped microehannel heat sink is introduced. The experiment of the simulated load addition of thermal source is carried out and the cooling performance of V-shaped microchannel with the V-shaped microchannel sample is tested. The area resistance is 0.0543K·cm^2/w.

关 键 词：微电子机械系统 微通道热沉 工艺 

分 类 号：TP305[自动化与计算机技术—计算机系统结构]