Sn晶须形态的研究  

Study on morphologies of Sn whisker

作　　者：郝虎[1] 史耀武[1] 夏志东[1] 雷永平[1] 郭福[1] 李晓延[1] 

机构地区：[1]北京工业大学材料科学与工程学院,100124

出　　处：《焊接》2008年第10期32-35,共4页Welding & Joining

基　　金："十一五"国家科技支撑重点项目"含有毒有害材料元素材料替代技术"(2006BAE03B02);北京市属市管高等学校人才强教计划资助项目"环境协调连接材料与加工技术"学术创新团队计划资助

摘　　要：添加微量稀土可以有效地改善钎料的综合性能。然而当钎料中添加过量的稀土时,钎料内部会形成体积较大的稀土相。如果将稀土相暴露于空气中,其将发生氧化,氧化产生的压应力将加速稀土相表面Sn晶须的生长。研究了CeSn3与YSn3与ErSr3稀土相表面Sn晶须的生长情况。研究结果表明,稀土相表面出现了Sn晶须的快速生长现象,且试验中发现了一些特殊形态的Sn晶须。Trace amount of rare-earth elements can effectively improve the comprehensive properties of solder.However,large-volume RE-phases will be formed when excessive amount of rare earth elements was doped in the solder,and if it was exposed to air,RE-phases will be oxidized which will result in compressive stress and accelerate the growth of tin whiskers.The Sn whisker growth on CeSn3 and YSn3 surface was investigated,and the results indicated that rapid Sn whisker growth was found on the surface of RE-phases,especially,some new whiskers with special morphologies were observed.

关 键 词：SN晶须 稀土 无铅钎料 SnAgCu合金 

分 类 号：TG425[金属学及工艺—焊接]