热压印中聚合物填充过程的仿真分析  

Simulation Analysis of the Filling Process of Polymer in Hot Embossing

作　　者：褚金奎[1,2] 郭庆[1,2] 孟凡涛[1,2] 韩志涛[1,2] 

机构地区：[1]大连理工大学精密与特种加工教育部重点实验室,辽宁大连116023 [2]辽宁省微纳米技术及系统重点实验室,辽宁大连116023

出　　处：《半导体技术》2008年第11期976-980,共5页Semiconductor Technology

基　　金：国家重点基础研究发展计划973项目(2006CB300407);国家自然科学基金项目(50775017)

摘　　要：基于有限元方法并借助ANSYS软件对热压印过程中二维的聚合物填充过程进行模拟。聚合物加热温度高于剥离转化温度时,采用Mooney-Rivlin模型表示聚合物的机械性能。详细分析了深宽比、凹槽宽度、占空比、摩擦系数对聚合物变形的影响。数值计算结果表明,深宽比对聚合物高度影响显著;凹槽宽度对聚合物形成单、双峰结构影响较大;占空比影响残留比率;摩擦系数对聚合物高度的影响较小。在制作高质量的热压印图形中,该数值分析结果有助于优化过程参数。Based on the finite element method and the ANSYS software, the 2D PMMA filling process in hot embossing was simulated. Mooney-Rivlin model was employed to describe the mechanical properties of polymer above its glass transition temperature. The effect of the aspect ratio, the width of the cavity, the duty ratio and friction coefficient on the deformation of the polymer was detailed analyzed. Numerical results present that aspect ratio significantly affects the PMMA displacement, cavity width plays a key role in the single or dual polymer deformation, duty ratio affects the residual ratio, friction coefficient has little effect on the PMMA displacement. The numerical results are helpful for the optimization of the process parameters in the fabricating of high-quality pattern using hot embossing.

关 键 词：热压印 聚合物 深宽比 凹槽宽度 占空比 摩擦系数 

分 类 号：TN305.7[电子电信—物理电子学]