用于微镜制作的叠层光刻胶工艺及残余应力控制  

Laminated photoresist layer technology and residual stress control for micromirror fabrication

作　　者：李加东[1,2] 张平[1] 吴一辉[1] 宣明[1] 刘永顺[1] 王淑荣[1] 

机构地区：[1]中国科学院长春光学精密机械与物理研究所应用光学国家重点实验室,吉林长春130033 [2]中国科学院研究生院,北京100039

出　　处：《光学精密工程》2008年第11期2204-2208,共5页Optics and Precision Engineering

基　　金：国家863高技术研究发展计划资助项目(B类)(No.2006AA04Z358);基于MEMS工艺的微型生化分析仪的研制(No.20060335)

摘　　要：对应用于微反射镜制作的叠层光刻胶牺牲层工艺及微反射镜表面残余应力控制进行了研究。讨论了光刻胶牺牲层在电镀时的污染问题,提出了用电镀结束后重新制作光刻胶牺牲层的方法来保证牺牲层表面质量。同时提出蒸发-电镀相结合的工艺,解决了上层光刻胶溶剂穿过中间结构层浸入底层光刻胶的问题,并通过控制蒸发与电镀过程中应力状态不同的两层金属薄膜的厚度解决了微反射镜镜面存在残余应力问题。最后成功释放了620μm×500μm×2μm,悬空高12μm的微反射镜结构。The laminated photoresist sacrificial layer technology and residual stress control in micromirror fabrication were investigated. Pollution problems in electroplating related to the photoresist sacrificial layer were discussed and their solutions were proposed. Through experiments,a new fabrication process is developed to solve the problem that the solvent in upper photoresist penetrates the electroplating base metal layers and dissolves the sacrificial layer to damage middle layer; the thicknesses of two kinds of metal films with different stress states in evaporating and electroplating processes are controlled to remove the residual stress on the surface of a micromirror. Employing these new technologies, the perfect flat micromirror with the size of 620 μm×500μm×2μm, and air gap height of 12μm is fabricated successfully.

关 键 词：微反射镜 叠层光刻胶 牺牲层 残余应力 

分 类 号：TN305.7[电子电信—物理电子学]