集成电路动态老化新技术的实施  

A New Method of Dynamic Burn-in Test for ICs

作　　者：朱卫良[1] 

机构地区：[1]中国电子科技集团公司第五十八研究所,江苏无锡214035

出　　处：《电子与封装》2008年第11期12-15,42,共5页Electronics & Packaging

摘　　要：在集成电路的可靠性评估试验中,动态老化项目是最重要的试验之一。文章提出了利用新技术对集成电路进行动态老化测试的全新方法,该新方法可以对老化线路板的关键电路信息和老化环境进行多路全面测试的监控,全面提高监控范围,及时发现老化过程中的工作异常,并减少人工,提高评估试验的可靠性,和其他方法相比有独特的优势。文中在技术上就集成电路具体实施动态老化试验过程中的技术细节和功能的实现进行探讨,分析和介绍老化技术中老化信号的生成和加载方法以及实时监控、数据采集方案。Dynamic burn-in test is the most important test in the reliability evaluation of integrated circuits. Thisarticle proposed a new method of Dynamic burn-in test, which monitors and controls multiple circumstance parameters and key circuit signals. This new method has unique advantages such us monitoring and controlling wider signal scope, observing abnormalities in real time, increasing the reliability of evaluation, and reducing the labor cost. The article discussed the technical details about functioning and implementation of this new method, introduced and analyzed the method of burn-in signal generating and loading and the solution of signal data collection and real time monitor and control.

关 键 词：可靠性 动态老化 监控 数据采集 

分 类 号：TN406[电子电信—微电子学与固体电子学]