镀金溶液中重金属杂质的常见分析方法  

Traditional Methods to Analyze Heavy Metallic Impurities in Gold Plating Solutions

作　　者：杨晓战[1] 沈卓身[1] 魏忻[1] 许维源[1] 

机构地区：[1]北京科技大学,中科院电子所

出　　处：《电子工艺技术》1998年第1期24-27,共4页Electronics Process Technology

摘　　要：为了降低镀金溶液中有害金属杂质的共沉积和提高镀金层质量，对镀金液中重金属杂质的分析方法进行了概述。In order to decrease the codeposition of harmful metallic impuities in gold plating solutions and improve quality of gold plating,a variety of traditional methods to analyze the heave metallic impurities in gold plating solutions are summarized and reviewed in this paper.

关 键 词：镀金溶液 重金属杂质 封装 半导体 微电子 

分 类 号：TN305.94[电子电信—物理电子学]