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机构地区:[1]上海交通大学微纳科学技术研究院,上海200240
出 处:《微纳电子技术》2008年第12期706-711,共6页Micronanoelectronic Technology
基 金:国家自然科学基金(50675139);国家863项目(2007AA04Z338)
摘 要:针对以金属嵌入式Su-8光刻胶作为新型弯曲梁式微驱动器结构材料的特点,在仿真分析过程中,考虑了狭小空气间隙中热传导机制的影响。分析结果表明,器件的工作电压随着悬空高度的增加而降低;当悬空高度达到270μm时,可忽略热传导机制。在微加工工艺流程中,引入新的牺牲层材料,显著提升了工艺流程的兼容性和加工效果的稳定性。在此基础上研制的新型电热微驱动器实测位移由11.5μm增大至13.9μm,这一结果与传统多晶硅材料弯曲梁式微驱动器的驱动位移5μm相比有显著提高,而能耗亦从180mW降至21.6mW,器件性能得到改善。According to the feature of Su-8 photoresist embedded metal as a new structure material for the curving beam micro actuator, the effect of the air heat conduction function in the narrow space was considered during the simulation analysis. The results show that the actuator working voltage decreases with the increase of the suspension height, and the heat conduction factor will be ignored when the suspension height reaches 270 μm. By introducing the new sacrificial layer material, the compatibility of technological process and processing stability of the curving beam micro actuator were improved. Based on the above research, the actual displacement of a new electro-thermal actuator is raised from 11.5 μm to 13.9 μm, which is better than 5μm displacement of the polycrystalline silicon curving beam micro actuator, while the energy consumption is decreased from 180 mW to 21. 6 mW. The performances of the device were improved obviously.
关 键 词:电热微驱动器 薄层空气热传导 Cu牺牲层 非硅表面微加工 微机电系统
分 类 号:TN603.5[电子电信—电路与系统] TH703[机械工程—仪器科学与技术]
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