玻璃/陶瓷体系低温共烧陶瓷的研究进展  

Development of Low Temperature Co-fired Glass/Ceramic Substrate

作　　者：陈兴宇[1] 张为军[1] 堵永国[1] 郑晓慧[1] 

机构地区：[1]国防科技大学航天与材料工程学院,湖南长沙410073

出　　处：《佛山陶瓷》2008年第12期43-47,共5页Foshan Ceramics

摘　　要：低温共烧陶瓷(LTCC)是现代微电子封装中的重要组成部分,因其性能优良而得到了广泛应用。LTCC基板材料可以分为玻璃/陶瓷体系和微晶玻璃体系两大类。本文叙述了玻璃/陶瓷体系低温共烧陶瓷的材料组成、研究现状、存在问题以及未来的发展趋势。Low temperature co-fired ceramics （LTCC） is the important composite of modern microeleetronic packaging. The perfect properties make it useful widely. The material can be divided into two kinds： glass/ceramic and glass ceramics. The paper is reviewed the composites and research progress of low temperature co-fired glass/ceramic substrate materials in details. The problems and trends of glass/ceramic substrate are also described.

关 键 词：低温共烧陶瓷 基板 玻璃/陶瓷 

分 类 号：TQ174[化学工程—陶瓷工业]