采用量纲分析法的MCM互连延迟建模  

Modeling of the Interconnection Delay in MCM’s Using Dimensional Analysis

作　　者：李珂[1] 来金梅[1] 林争辉[1] 

机构地区：[1]上海交通大学大规模集成电路研究所

出　　处：《微电子学》1998年第1期41-44,共4页Microelectronics

摘　　要：高性能多芯片系统中，互连延迟对整个系统的延迟结果起决定性作用。利用量纲分析法首先对ＭＣＭ的互连延迟进行数学建模，继而利用曲线拟合法求出了所建数学模型中的待定系数，并进一步对此结果进行了必要的分析。该方法的优点是不涉及传输线的电报方程，避免了复杂的数学运算，得到的互连延迟模型能有效地模拟互连延迟的实际情况。Models for interconnection delays in MCM’s are established using dimensional analysis The coefficients in the mathematical model is obtained by curve fitting method Futher analysis of this approach and experimental results are also presented With the proposed technique,the need for complex mathematical operation is eliminated and the resultant model can efficiently simulate the actual interconnection delays in MCM’s

关 键 词：多芯片组件 建模 互连延迟 量纲分析 

分 类 号：TN42[电子电信—微电子学与固体电子学]