塑封器件无损检测技术探讨  

Study on the Non-destructive Test Technology of Plastic Encapsulated Microcircuit

作　　者：林湘云[1] 徐爱斌[1] 

机构地区：[1]工业和信息化部电子第五研究所,广东广州510610

出　　处：《电子产品可靠性与环境试验》2008年第6期25-27,共3页Electronic Product Reliability and Environmental Testing

摘　　要：塑封器件由于其结构和材料等因素的影响,存在一些特有的潜在缺陷,在其装入整机之前必须经过检验以降低风险。塑封器件的无损检测技术,不仅能剔除早期失效样品,而且能有效地识别和剔除有潜在缺陷的器件,从而达到提高电子整机可靠性的目的。Some special latent defects existed in PEM because of its structure and materials. In order to reduce risk, PEM must be inspected before assembling. Non-destructive test technology can be used for PEM to not only eliminate infant failures, but also identify the latent defect devices to improve the reliability of the final electronic equipment.

关 键 词：塑封器件 潜在缺陷 无损检测技术 

分 类 号：TN407[电子电信—微电子学与固体电子学]