片式多层瓷介质电容器用的Pd-Ag端电极浆料  

A Pd-Ag Terminal Electrode Paste Applied to Chip Multilayer Ceramic Dielectric Capacitors

作　　者：王昆福[1] 俞守耕[1] 任金玉[1] 陈子荣 

机构地区：[1]中国昆明贵金属研究所 [2]中国成都成都715厂

出　　处：《贵金属》1998年第1期18-20,共3页Precious Metals

摘　　要：以环氧、酚醛树脂做有机载体，金属氧化物做无机粘结剂，选用松装比重１．９左右超细Ａｇ／Ｐｄ粉混合做导电相配制的浆料，能满足涂敷ＭＬＣ端头的生产工艺，并达到ＧＢ—８２２４—８８标准。Formulation of paste in which epoxy-,and phenolic-resins were as organic vehicles, metal oxides were as inorganic binders, Ag-, and Pd-powders with loose density～1.9g/cm^3 were selected as conductive phases after mixed. The paste could be adapted to the technology applied on MLC terminals, and had achieved requirements of GB-8224-88 criterion

关 键 词：瓷介质 Pd-Ag端电极 电容器 浆料 

分 类 号：TM534.1[电气工程—电器]