金属基底上三维可动微机构的制作  

Fabrication of 3D Movable Micro-Mechanism on Metal Substrate

作　　者：杜立群[1,2] 喻立川[1] 刘文涛[2] 宋磊[2] 

机构地区：[1]大连理工大学精密与特种加工教育部重点实验室,大连116024 [2]大连理工大学辽宁省微纳米技术及系统重点实验室,大连116024

出　　处：《纳米技术与精密工程》2009年第1期36-40,共5页Nanotechnology and Precision Engineering

基　　金：国家自然科学基金资助项目(50675025);国家科技支撑计划项目( 2006BAF04B13)

摘　　要：在无背板生长工艺的基础上,以SU-8胶为牺牲层,直接在金属 Ni 基底上制作出了一种三维可动微机构.该器件的制作主要采用了SU-8厚胶光刻工艺、高深宽比结构的微电铸工艺以及牺牲层工艺.就SU-8胶与金属基底结合差、易产生气泡、去除困难,铸层与金属基底之间以及铸层与铸层之间结合不牢等问题进行了讨论,采用了过渡层工艺、梯度升温工艺以及酸洗等方法予以解决.对于在金属基底上通过微电铸制作微结构的工艺而言,由于基底可以直接作为微结构的一部分,因此该工艺的优势在于节省了微结构的电铸时间,降低了铸层的生长应力,提高了结构的整体强度,使微器件的可靠性大大增加.电铸时间由原来的几天甚至几周缩短为二十几个小时,避免了出现由铸层内应力引起的铸件结构变形的问题.Based on the no back plate growing technology, with SU-8 film as sacrificial layer, a kind of three dimensional movable micro-mechanism was fabricated directly on mental substrate. The key fabricating technologies mainly involve optical lithography of SU-8 thick photoresist technology, high-aspect-ratio structure micro-electroforming technology, and sacrificial layer technology. This paper discussed poor adhesive property between SU-8 film and metal substrate, bubbles in SU-8 film, problem of hard removal of SU-8 photoresist and low adhesion strength between substrate and electroforming layer or between the first electroformed layer and the second one. Adhesion promoter layer technology, technology of step by step increase in temperature, and strict pickling technology were employed to solve the problems in the process. In the process of fabricating metal microstrncture direct on metal substrate by microelectroforming technology, the substrate could be used as a part of the final structure. This method has many advantages, such as saving fabricating time, reducing growing internal stress, improving strength and reliability of the final structure. Electroforming time decreased from several days even several weeks to several hours and the deformation caused by internal stress was eliminated in the process.

关 键 词：SU-8厚胶光刻 微电铸 牺牲层技术 微结构 可动机构 

分 类 号：TG66[金属学及工艺—金属切削加工及机床]