微波组件用pin梁式引线管热元模型分析研究  

Thermal Analysis of Beam Lead PIN Diode for Microwave Modules

作　　者：谢国雄[1,2] 来萍[2] 王雪松 宋芳芳[2] 王韧 代海锋 

机构地区：[1]广东工业大学,广东广州510075 [2]工业和信息化部电子第五研究所,广东广州510610 [3]成都亚光电子股份有限公司,四川成都610051

出　　处：《电子产品可靠性与环境试验》2009年第1期43-47,共5页Electronic Product Reliability and Environmental Testing

摘　　要：在微波组件中,有源器件是主要热源,它们对微波组件的热性能具有决定性的作用。基于ANSYS有限元分析软件,采用有限元分析法,针对某型号微波组件用pin梁式引线管热元模型进行了模拟和分析。模拟结果与实际样品的红外热像测试结果基本一致,表明热元模型正确地反映了pin管在组件中的热性能状况情况。热元模型的建立能快速、简便地获得组件中单个管芯的温度分布情况,可缩短热设计与测试周期。The active devices are the main heat sources in microwave modules and determines their thermal performance. A beam lead PIN diode for a microwave module was simulated and analyzed with the ANSYS-based finite element software. The simulated results were basically agreed with the thermal imaging test of the real samples, which implied that the thermal element model correctly reflected the thermal performace of the PIN diode in the module. Using the thermal element model, the temperature distribution of a specific die in a module can be easily and quickly obtained to reduce the thermal design and test cycle.

关 键 词：微波组件 热分析 有限元 结温 

分 类 号：TN62[电子电信—电路与系统]