基于正交试验法的高速背板焊点热疲劳可靠性分析  

Thermal Fatigue Reliability Analysis of High Speed Backplane Solder Joint Based on Orthogonal Experiment

作　　者：张立强[1] 吴兆华[1] 李永利[1] 陈小勇[1] 

机构地区：[1]桂林电子科技大学机电工程学院,广西桂林541004

出　　处：《电子质量》2009年第3期45-47,50,共4页Electronics Quality

摘　　要：针对某特定电子整机的布局,研究了背板的备用线数量及接口布局;以高速互联背板焊点为研究对象,基于正交试验法,建立不同组合水平下的有限元分析模型;利用ANSYS软件,对背板焊点在热循环加载条件下的热应力分析,利用修正后的Coffin-Manson方程对其进行寿命预测,获得了较好的结果。With a special electrical equipment, research on the stand-by line number and the interface layout in the backplane, The solder joints in the high-speed backplane are taken as research object, Based on the orthegonal experiment, established the different combined finite element analysts models;Analyzed the backplane solder Joint under thermal cyclic by using ANSYS, and used the modified Coffin-Manson equation predict their thermal fatigue life, obtain some good results.

关 键 词：背板 热循环 有限元 热疲劳寿命 

分 类 号：TN406[电子电信—微电子学与固体电子学]